Simpler bonding/debonding process needed; New methods to reduce time and cost of R&D; The Big Five challenges facing the semiconductor industry

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Top stories Brewer Science: Simpler bonding/debonding process needed A variety of techniques and materials have been developed to successfully achieve bonding/debonding, but Tony Flaim, chief technology officer of Brewer Science says they are still too complicated. Share: Hybrid Memory Cube nears engineering sample milestone Engineering samples of The Hybrid Memory Cube are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers. Share: Book-to-bill ratio: Six consecutive months above parity A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month. Share: Semiconductor roadmapping update: Front-end technologies Part 1 In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors Front End of Line Technologies. Share: Tech news New methods to reduce time and cost of R&D SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9. Share: Leti discusses different lithography options for advanced technology nodes at SEMICON West 2013 At Leti Day during SEMICON West, Leti Lithography Program Manager Serge Tedesco highlighted different lithography options for advanced technology nodes. Share: SEMICON West R&D panel discusses the future of semiconductor technology Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning at SEMICON West. Share: Imec reveals method of damage free cryogenic etching of ultralow-k dielectrics Imec announced a cryogenic etching method that protects the surface of porous ultralow-k dielectrics against excessive plasma induced damages. Share: More tech news • Leti and EV Group launch a common lab on wafer bonding technologies • cyberTECHNOLOGIES introduces Interferometric accuracy on suite of Surface Metrology Systems Business news SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. Dow Corning joins imec for advancement of enabling technologies for 3D-IC Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. Element Six increases global manufacturing capacity for microwave CVD synthetic diamond At SEMICON West 2013, Element Six announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year. Boston University sues Apple over semiconductor patent infringement Boston University filed a lawsuit against Apple Inc. and several other big tech companies over an alleged patent infringement, a thin film semiconductor technology that they claim was developed by one of their professors. More business news • Toshiba to expand semiconductor fabrication facility Product news EVG320RS XT platform. (PRNewsFoto/EV Group) EV Group launches new LowTemp room temperature debonding platform EV Group introduced its LowTemp debonding platform, which features three different room-temperature wafer-debonding processes and an extended material supply chain. ROFIN presents turnkey solutions for FEOL applications ROFIN, a manufacturer of industrial lasers and laser systems enters the semiconductor market with a turnkey solution for front-end-of-line (FEOL) processing. Scrubber developed for POU abatement of wet bench gases DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications. Share:

News Editor Shannon Davis 603-891-9145 shannond@pennwell.com

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