Hybrid Memory Cube nears engineering sampling milestone; Interview with Brewer Science CTO; Big gains forecast in quarterly DRAM ASP; Week's most popular articles

Solid State Technology Pulse |View online|Send this message to a friend

July 19, 2013

“Today’s Critical Electronics Manufacturing News.” In this issue: • Hybrid Memory Cube nears engineering sample milestone • Brewer Science: Simpler bonding/debonding process needed • Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion • Tune in to the Solid State Watch • Interview with Brewer Science CTO on bonding/debonding materials • ASML at SEMICON West 2013: SRAM scaling has stopped! • Micron unveils 16nm Flash memory technology • Semiconductor roadmapping update: Front-end technologies – Part 2 • Big gains forecast in quarterly DRAM ASP • Cornucopia of choices spurs smartphone market to double by end of 2017 • Thin is in: Sales of slender hard disk drives soar as PCs slim down • SEMI announces Vietnam Semiconductor Strategy Summit • SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry • Semiconductor roadmapping update: Front-end technologies Part 1 • TSMC keynoter suggests WLSI at IITC • A dispatch from SEMICON West From our Sponsor Custom Feedthrough Assemblies. Rigaku offers custom-engineered solutions from simple feedthroughs to feedback controlled subsystems for managing motion. Included are function-enhanced feedthroughs for high pressure operation, feedthroughs with purge ports and gas induction types. We also provide a range of custom vacuum magnetic rotary seals for robots that utilize multiaxial, bellows and dustproof seals. Top stories Hybrid Memory Cube nears engineering sample milestone Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. More>> Share: Brewer Science: Simpler bonding/debonding process needed A variety of techniques and materials have been developed to successfully achieve bonding/debonding, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated. More>> Share: Epi-wafer market to grow to $4 billion in 2020 as LED lighting zooms to $80 billion As LED lighting becomes an $80 billion industry, the market for the epitaxial wafers (epi-wafers) LEDs are made from will grow to $4 billion in 2020, according to Lux Research. More>> Share: Tune in to the Solid State Watch Check out the Solid State Watch weekly wrap-up to get the latest industry headlines. More>> Share: Tech news Interview with Brewer Science CTO on bonding/debonding materials At The ConFab 2013, Brewer Science CTO Tony Flaim talks about the status of materials used for bonding/debonding in 3D integration. More>> Share: ASML at SEMICON West 2013: SRAM scaling has stopped! Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from SEMICON West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell." More>> Share: Micron unveils 16nm Flash memory technology Micron Technology announced that it is sampling next-generation, 16-nanometer (nm) process technology, enabling the industry’s smallest 128-gigabit (Gb) multi-level cell (MLC) NAND Flash memory devices. More>> Share: Semiconductor roadmapping update: Front-end technologies – Part 2 SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending lithography technology to pattern device structures below a half-pitch of 20nm. More>> Share: More tech news • Waves of change in advanced electronics materials to be explored at SEMI Strategic Materials Conference 2013 • SRC and Environmental Research Center create new cyclic purge technique Business news Big gains forecast in quarterly DRAM ASP DRAM average selling prices (ASPs) have increased every month throughout 2013 and are now at levels last seen in October 2010. More>> Share: Cornucopia of choices spurs smartphone market to double by end of 2017 With most of the top brands introducing new flagship models in the first half of 2013, smartphone buyers now have more choices than ever, a phenomenon that will contribute to an expected doubling in market shipments from 2012 to 2017. More>> Share: Thin is in: Sales of slender hard disk drives soar as PCs slim down A new generation of thin hard disk drives (HDD) only 5.0 and 7.0mm thick are expected to enjoy fast sales growth in coming years, as mobile computers including ultrathin PCs and PC tablets drive up demand by a factor of more than 25 from 2012 to 2017. More>> Share: SEMI announces Vietnam Semiconductor Strategy Summit Executives from the world’s leading microelectronics companies will meet with delegates representing Vietnamese government, academia, research, and industry to explore and discuss the key strategies and opportunities in the growing Vietnam semiconductor industry at the SEMI Vietnam Semiconductor Strategy Summit. More>> Share: Week's most popular articles SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. More>> Share: Semiconductor roadmapping update: Front-end technologies Part 1 In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies. More>> Share: TSMC keynoter suggests WLSI at IITC In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult. More>> Share: A dispatch from SEMICON West Applied Materials launches epi system focused on NMOS strain. More>> Share:

News Editor Shannon Davis (603) 891-9145 shannond@pennwell.com

If you are a current subscriber, you can unsubscribe from this newsletter by clicking this link: here You may also contact us to by clicking here or you can write to us at: PennWell Corporation c/o E-mail Unsubscribe 1421 South Sheridan Road Tulsa, OK 74112 USA If you do not subscribe to this newsletter and would like to receive it, please visit: http://www.electroiq.com/index/subscribe/newsletters.html