Getting ready for 10/100/20 | New methods to reduce time and cost of R&D | SEMI announces Strategic Materials 2013 conference

Solid State Technology MEMS Direct| July 29, 2013 |View online

Home

MEMS

Applications

Manufacturing

Packaging & Test

In this issue: • Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway • European-Japanese collaboration focuses on ‘Cloud of Things’ to support smart cities • SEMI sees 21% increase in chip equipment spending for 2014 • Dow Corning joins imec for advancement of enabling technologies for 3D-IC • New methods to reduce time and cost of R&D • New NIST nanoscale indenter takes novel approach to measuring surface properties • SOCRATE Project focuses on miniature antennas with super-directivity radiation properties • Scrubber developed for POU abatement of wet bench gases • Micralyne and Adament to develop MEMS-based fiber-optic subsystems • EU FP7 continues to support Europractice IC services • CEA-Leti receives 1M euro in funding from bpifrance • Waves of change in advanced electronics materials to be explored at SEMI Strategic Materials Conference 2013 Top news Getting ready for 10/100/20 – Europe’s manufacturing initiative is underway Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets. European-Japanese collaboration focuses on ‘Cloud of Things’ to support smart cities CEA-Leti today announced that a group of European and Japanese companies, research institutes, universities and cities will work together in the ClouT project to deliver ways for cities to leverage the Internet of Things (IoT) and cloud computing – to become smart cities. SEMI sees 21% increase in chip equipment spending for 2014 SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending. Dow Corning joins imec for advancement of enabling technologies for 3D-IC Dow Corning announced that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. From our Sponsor Want better Etch results? Ulvac's Deep Etch Foundry Service enables you to achieve more reliable and repeatable process performance for your MEMS, MOEMS, microfluidic and photonic devices. You'll get ultra high aspect ratios, optical smooth surfaces and sidewall angle control. Ulvac helps you accelerate device fabrication, eliminate prototype to product variability and reduces costly time-to-market delays. etchservices@us.ulvac.com; 978-686-7550 Click here for more information Tech news New methods to reduce time and cost of R&D SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9. New NIST nanoscale indenter takes novel approach to measuring surface properties Researchers from the National Institute of Standards and Technology and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films. SOCRATE Project focuses on miniature antennas with super-directivity radiation properties CEA-Leti said that it and three partners in the SOCRATE project are developing innovative concepts to significantly improve the directivity of electrically small antennas. Scrubber developed for POU abatement of wet bench gases DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications. Business news Micralyne and Adament to develop MEMS-based fiber-optic subsystems Micralyne, Inc.announced a collaboration with Adamant-Kogyo Co., Ltd. for the development and manufacture of MEMS-based fiber-optic subsystems. EU FP7 continues to support Europractice IC services Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7). CEA-Leti receives 1M euro in funding from bpifrance CEA-Leti announced 1 million euro in funding from bpifrance to accelerate preclinical development of a liver-cancer detection system called LipImage 815. Waves of change in advanced electronics materials to be explored at SEMI Strategic Materials Conference 2013 The latest trends, challenges and business opportunities in advanced materials for semiconductors, MEMs, power devices, storage, and other electronic devices will be addressed at the 2013 SEMI Strategic Materials Conference (SMC), to be held on October 16-17 at the Santa Clara Marriott in Silicon Valley, California.

Share:

Web Editor Shannon Davis 603-891-9145 shannond@pennwell.com

Subscription Information

SST invites you to forward this newsletter to colleagues or associates who might be interested in our weekly news summaries.

If you are a current subscriber, you can unsubscribe from this newsletter by clicking this link: here

You may also contact us to by clicking here or you can write to us at:
PennWell Corporation
c/o E-mail Unsubscribe
1421 South Sheridan Road
Tulsa, OK 74112
USA

If you do not subscribe to this newsletter and would like to receive it, please visit: http://www.electroiq.com/index/subscribe/newsletters.html

  © 2013 PennWell Corporation. All Rights Reserved.