Collaboration focuses on developing 'smart cities'; Highlights from the Lithography Panel at SEMICON West; High-resolution tablet panels debut with strong shipments in 2013

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July 23, 2013

“Today’s Critical Electronics Manufacturing News.” In this issue: • European-Japanese collaboration focuses on ‘Cloud of Things’ to support smart cities • Book-to-bill ratio: Six consecutive months above parity • OEM chip spending returns to growth in 2013 • Interview with Brewer Science CTO • Still a tale of two paths: Highlights from the Lithography Panel at SEMICON West 2013 • Temporary bonding discussions at ECTC 2013 • Cree SiC MOSFETs to be incorporated into advanced power suppliers from Delta Elektronika • Scrubber developed for POU abatement of wet bench gases • High-resolution tablet panels debut with strong shipments in 2013 • LCD TV panel inventory rises to excess level, spurring price drops • ON Semiconductor receives ISO 13485 certification for its advanced packaging facility • SEMATECH and Air Products join forces From our Sponsor Solid State Technology iPhone app is available! • Read the latest news stories • Save articles for future reference • Watch videos • Share Solid State Technology with colleagues on FB, Twitter, email CLICK HERE to download Top stories European-Japanese collaboration focuses on ‘Cloud of Things’ to support smart cities CEA-Leti today announced that a group of European and Japanese companies, research institutes, universities and cities will work together in the ClouT project to deliver ways for cities to leverage the Internet of Things (IoT) and cloud computing – to become smart cities. More>> Share: Book-to-bill ratio: Six consecutive months above parity A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month. More>> Share: OEM chip spending returns to growth in 2013 After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender. More>> Share: Interview with Brewer Science CTO At The ConFab 2013, Brewer Science CTO Tony Flaim discussed the status of materials used for bonding/debonding in 3D integration. More>> Share: Tech news Still a tale of two paths: Highlights from the Lithography Panel at SEMICON West 2013 This year, Vivek Bakshi moderated the industry’s Lithography Panel during SEMICON West 2013 to a standing room only crowd. More>> Share: Temporary bonding discussions at ECTC 2013 Dr. Phil Garrou continues his review of ECTC 2013. More>> Share: Cree SiC MOSFETs to be incorporated into advanced power suppliers from Delta Elektronika Cree, Inc. announced that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV. More>> Share: Scrubber developed for POU abatement of wet bench gases DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications. More>> Share: From our Sponsor Business news High-resolution tablet panels debut with strong shipments in 2013 Making a stellar debut, high-resolution liquid-crystal display (LCD) panels featuring resolutions of 300 pixels per inch (ppi) or more are appearing in media tablets for the first time this year, with shipments set to approach 13 million units. More>> Share: LCD TV panel inventory rises to excess level, spurring price drops Global inventory of liquid-crystal display television (LCD TV) panels is set to rise to its highest level in 19 months in August, with the elevated stockpiles expected to contribute to a decline in prices in the second half of the year. More>> Share: ON Semiconductor receives ISO 13485 certification for its advanced packaging facility ON Semiconductor announced that its Burlington, Canada, advanced packaging facility has received ISO 13485:2003 certification, the international quality management system standard for the design and manufacture of medical devices. More>> Share: SEMATECH and Air Products join forces SEMATECH announced that Air Products, a global industrial gas and technology company, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10nm node III-V devices. More>> Share:

News Editor Shannon Davis (603) 891-9145 shannond@pennwell.com

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